Odisha Signs 2,655 Cr MoUs at SEMICON India 2025 Conclave

• Odisha signs 2,655 crore MoUs at SEMICON India 2025 for semiconductor units.
• Agreements with TopTrack (1,005 crore) and SancodeTech (1,650 crore).
• Engagements with Intel, Renesas, and others boost Odisha’s semiconductor hub status.

Odisha Chief Minister Mohan Charan Majhi stated that the state signed Memorandums of Understanding (MoUs) amounting to 2,655 crore at the SEMICON India 2025 Conclave in New Delhi to build semiconductor units, establishing Odisha as an emerging semiconductor and advanced electronics destination.

The agreements include 1,005 crore with TopTrack Hi-Tech PCB Pvt. Ltd. to build a state-of-the-art printed circuit board manufacturing facility, and 1,650 crore with Sancode Technologies Ltd., in partnership with Silicon Connect, Inari Amertron Berhad, and APIRC Penang, to establish a semiconductor facility focused on VLSI and packaging excellence.

Also Read: Tata Electronics, Merck Sign MoU to Bolster India's Semiconductor Materials

Majhi opened the Odisha Pavilion, interacting with overseas companies like Intel, Micron, Western Digital, Renesas, and Siemens. The state similarly embraces the India Semiconductor Mission, with Odisha's Semiconductor Manufacturing & Fabless Policy 2025 and Electronics Component Manufacturing Policy 2025 intending to create a supporting environment for innovation and investment. Talks with RIR Power Electronics supported the construction of a SiC wafer fabrication facility.

Their clean room will be operational in September 2025, with production starting in December 2025. Renesas discussed interest in joint ventures and embedded design training with IIT Bhubaneswar, while SancodeTech included a skilling center for the youth of Odisha and a possible G2G with Malaysia in their MoU. The SiCSem plant ground-breaking will occur in mid-October 2025, which will benefit India's chip manufacturing capacity.