ISIG Summit Targets Growth in India's Chip Packaging,Power Electronic

ISIG plans a New Delhi executive summit to strengthen India's advanced chip packaging and power electronics sectors, bringing industry leaders, investors and policymakers together to discuss domestic manufacturing and supply-chain development.

The International Semiconductor Industry Group (ISIG) is seeking to strengthen India's position in the global semiconductor industry, with a focus on advanced chip packaging and power electronics. The industry body plans to bring together semiconductor executives, investors, venture capitalists and government officials through a two-day executive summit in New Delhi on November 3 and 4, 2026, to discuss technology development, domestic manufacturing and supply-chain opportunities.

Speaking at a media roundtable, ISIG Co-founder and Chief Executive Officer Salah Nasri said the summit would focus on segments expected to play an increasingly important role in the semiconductor industry. These include advanced packaging and power electronics, where India has opportunities to develop domestic capabilities and participate in higher-value manufacturing activities.

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Advanced semiconductor packaging has gained strategic importance as demand for artificial intelligence (AI), high-performance computing and other advanced applications increases. Traditionally considered a back-end manufacturing activity, packaging is now becoming a critical part of chip performance and system integration. The development of technologies such as chiplets and multi-die integration has further increased the importance of advanced packaging in the global semiconductor ecosystem.

Nasri noted that the industry's perception of packaging has changed considerably over the past decade. Demand growth following the Covid-19 pandemic and the expansion of AI applications have brought the segment into greater focus among semiconductor companies and governments. He said India has the potential to emerge as an important geography in this area, alongside established semiconductor markets such as the United States, Taiwan, Japan, South Korea and China.

ISIG India Chapter President and Paras Semiconductors Chief Executive Officer Santosh Kumar said the organisation intends to help bridge the gap between planning and execution for advanced packaging and power electronics manufacturing projects. He highlighted the need to strengthen domestic capabilities, develop reliable supply chains and enable Indian companies to move towards higher-value semiconductor production.

The November summit will cover advanced semiconductor packaging, outsourced semiconductor assembly and test (OSAT), power electronics and wide-bandgap technologies, including silicon carbide (SiC) and gallium nitride (GaN). Discussions will also address India's semiconductor strategy, investment opportunities, research and development, and collaboration between domestic and international industry participants.

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The event is expected to provide a platform for industry leaders and policymakers to examine practical requirements for expanding India's semiconductor ecosystem. Strengthening local manufacturing, attracting investment, developing specialised talent and improving supply-chain resilience will be important areas of discussion.

Through the initiative, ISIG aims to support greater industry collaboration and accelerate the development of India's advanced packaging and power electronics capabilities.