Centre Clears Four New Semiconductor Projects Worth 4,600 Cr

• Pan-India Expansion: Four semiconductor units in Odisha, Andhra Pradesh, and Punjab; ₹4,600 crore investment.
• Full Capability: Includes chip fabrication, ATMP, and module production.
• Self-Reliance Push: Strengthens Make in India and semiconductor independence.

In a bold step to boost domestic chip manufacturing, the Indian Government has approved four new semiconductor fabrication units as part of the India Semiconductor Mission worth ₹4,594 crore.

The projects are located in Odisha (two units), Andhra Pradesh (one unit), and Punjab (one unit)—demonstrating the distribution glide of pan-India, to strengthen electronics fabrication and decrease dependence on imports.

Also Read: Tata, Bosch Partner for Semiconductor & Electronics Growth

These facilities will cover the whole continuum of capabilities needed to produce chips, including packaging, assembly, testing, and specialized module production capacity, which will contribute to India's high-tech manufacturing ecosystem. This expansion, which accompanies six semiconductor units currently under implementation, will occur alongside the broader Make in India program.

Expected outcomes include the enhancement of technology sovereignty, high-skill employment, strengthened regional manufacturing clusters, and increased resilience regarding critical supply chains indispensable to industries such as electronics, telecommunications, defense, and others.