Japan's Hirata Enters India with ATS Partnership in Chip Equipment

Hirata Corporation enters India through an exclusive partnership with ATS India to supply semiconductor automation and material-handling equipment, supporting the country’s expanding chip manufacturing and advanced packaging ecosystem.

Japanese automation and semiconductor equipment manufacturer Hirata Corporation is entering the Indian semiconductor market through a strategic partnership with ATS India, as the country expands its chip manufacturing and advanced packaging ecosystem. Under the agreement, ATS India becomes Hirata’s exclusive distribution partner in India and initially focuses on bringing the Japanese company’s standard semiconductor automation technologies to domestic manufacturers.

The initial portfolio includes Equipment Front End Modules (EFEMs), FOPLP load ports, PLP panel-handling robots and high-performance wafer-handling robots. These systems support the precise movement and handling of wafers and panels across semiconductor manufacturing and advanced packaging operations. The technologies are intended to improve automation, reliability and efficiency in processes that require controlled material handling.

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ATS India estimates that the addressable market for semiconductor automation in the country could reach approximately $100 million by 2030. Hirata’s entry comes as India develops semiconductor fabrication, outsourced semiconductor assembly and testing (OSAT), and advanced packaging capabilities, creating demand for specialised manufacturing equipment and automation solutions.

The partnership builds on an existing relationship between Hirata and ATS that spans more than a decade across sectors including automotive. The companies are now extending their collaboration into semiconductors to support the requirements of India’s emerging chip manufacturing ecosystem. Hirata says its semiconductor business accounts for about half of its global annual business and that it supplies automation solutions used in areas including lithography, wafer cleaning and metrology.

The companies also highlight the potential for stronger local access to semiconductor equipment. With Hirata’s technologies being made available through an Indian distribution and engineering partner, manufacturers can access equipment and technical support closer to their operations, reducing reliance on cross-border logistics and potentially shortening support timelines.

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The collaboration comes as India places greater emphasis on developing semiconductor equipment, packaging, manufacturing and design capabilities as part of its broader electronics manufacturing strategy. Government initiatives also identify semiconductor equipment as one of the strategic areas supporting the development of a domestic chip ecosystem.